ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,644, issued on Sept. 22, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa). "Mechanical mitigation of neutron see" was invented b... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,645, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and m... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,646, issued on Sept. 22, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manu... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,647, issued on Sept. 22, was assigned to Mitsubishi Electric Corp. (Tokyo). "High frequency transistor" was invented by Shinsuke Watanabe ... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,648, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assembly having antiferromagnetic film struct... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,649, issued on Sept. 22, was assigned to Sumitomo Electric Device Innovations Inc. (Yokohama, Japan). "Semiconductor device and wafer" was... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,650, issued on Sept. 22, was assigned to AaltoSemi Inc. (Nanjing City, China). "Package substrate and fabricating method thereof" was inve... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,651, issued on Sept. 22, was assigned to PHOENIX PIONEER TECHNOLOGY Co. LTD. (Hsinchu County, Taiwan). "Semiconductor package carrier boar... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,652, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufa... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,653, issued on Sept. 22, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo). "Semiconductor device package with flat plate... Read More